F2224-11P Ver la hoja de datos (PDF) - Hamamatsu Photonics
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F2224-11P Datasheet PDF : 8 Pages
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MCP ASSEMBLIES
Demountable Type Series (The MCP and the Read-Out Device Can be Easily Replaced)
ASSEMBLY DIMENSIONS (Unit: mm)
A
G
B
K
C
45
4- 4.5
3
20
MCP-IN LEAD
3
MCP
ANODE OR
1.0
PHOSPHOR SCREEN LEAD
L
READ-OUT
REPLACEMENT RING
4- 3.5
INSULATOR(Al2O3)
NUT M2(SUS304)
E
MCP-OUT LEAD
D
LEAD (SUS)
READ-OUT
DEVICE
DEGASSING
SPACE
SUBSTRATE
(SUS304)
TMCPA0026EB
Note: SUS and SUS304 are stainless steels of Japanese Industrial Standards (JIS) code.
Code
Parameter
A Assembly Outer Diameter
B Mounting Screw Hole Pitch
C Insulator Outer Diameter
D Assembly Screw Pitch
E MCP Effective Diameter
F Readout Device Effective Diameter
G Maximum Height
H Replacement Ring Screw Diameter for Readout Device
J Replacement Ring Inside Diameter for Readout Device
K Distance from Bottom of Substrate to
Insulator Surface
F2221 F2222 F2223
54
61
69
46
53
61
34
41
49
26
33
41
14.5
20
27
10
17
24
15
15
15
M19
M26
M33.8
13
20
27
(Number of MCP stages)
Single-stage: 10.9
Two-stage : 11.9
Three-stage : 11.9
(Number of MCP stages)
L Distance from MCP Input Surface to
Insulator Surface
Single-stage:
Two-stage :
Three-stage :
F2224 F2225 F2226 Unit
75
86
123 mm
67
78
115 mm
55
66
103 mm
47
58
95
mm
32
42
77
mm
30
40
75
mm
15
15
17
mm
M39.5
M51
M88
—
33
44
78
mm
—
12.9 mm
14.4 mm
15.9 mm
(Channel diameter)
—
10µm
12µm
25µm
—
2.9
2.8
3.8
mm
3.5
3.3
4.3
mm
3.1
2.9
4.8
mm
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