TGA8344-SCC Ver la hoja de datos (PDF) - TriQuint Semiconductor
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TGA8344-SCC Datasheet PDF : 11 Pages
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RECOMMENDED
ASSEMBLY
DIAGRAM
Product Data Sheet
TGA8344-SCC
RF connections: Bond using two 1.0-mil diameter, 20 to 30-mil-length gold bond wires at both RF Input and
RF Output for optimum RF performance.
V- = V 1 - = V 2 -
Two on-chip to on-chip wire bonds are needed for bond pads 3 and 13.
Close placement of external components is essential to stability.
Refer to TriQuint’s Gallium Arsenide Products Designers’ Information on our website
under Application Information.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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