TGA4506-SM Ver la hoja de datos (PDF) - TriQuint Semiconductor
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TGA4506-SM Datasheet PDF : 10 Pages
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Advance Product Information
November 14, 2005
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak
Temperature
Ramp-down Rate
SnPb
3 °C/sec
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
10
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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