TGA2507-EPU Ver la hoja de datos (PDF) - TriQuint Semiconductor

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Fabricante

TGA2507-EPU

12-18 GHz Ku-Band 3-Stage Driver Amplifier

TriQuint Semiconductor 

Advance Product Information

December 5, 2004

TGA2507-EPU

Chip Assembly Diagram

This configuration is for a self-bias logic pad current search with connections for bin

#1. See Table IV for alternate bin # to get the current of typical 80 ± 10% mA.

BIN No.

1

2

3

4

TABLE V

PAD CONNECTIONS

DC BIAS LADDER 1

Pad 6 to Pad 7

Pad 6 to Pad 8

Pad 6 to Pad 9

Pad 6 to Pad 10

DC BIAS LADDER 2

Pad 11 to Pad 12

Pad 11 to Pad 13

Pad 11 to Pad 14

Pad 11 to Pad 15

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice

9

TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

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