TEA1523P Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Fabricante

TEA1523P

SMPS ICs for low-power systems

NXP Semiconductors. 

NXP Semiconductors

TEA152x

SMPS ICs for low-power systems

5. Ordering information

Table 2. Ordering information

Type number Package

Name

Description

TEA1520P DIP8

plastic dual in-line package; 8 leads (300 mil)

TEA1521P DIP8

plastic dual in-line package; 8 leads (300 mil)

TEA1522P DIP8

plastic dual in-line package; 8 leads (300 mil)

TEA1523P DIP8

plastic dual in-line package; 8 leads (300 mil)

TEA1520T SO14

plastic small outline package; 14 leads; body width 3.9 mm

TEA1521T SO14

plastic small outline package; 14 leads; body width 3.9 mm

TEA1522T SO14

plastic small outline package; 14 leads; body width 3.9 mm

6. Block diagram

Version

SOT97-1

SOT97-1

SOT97-1

SOT97-1

SOT108-1

SOT108-1

SOT108-1

VCC 1 (1)

2 (2, 3, 4,

5, 9, 10)

GND

TEA152x

SUPPLY

LOGIC

VALLEY

8 (14)

DRAIN

7 (12, 13)

n.c.

100 mV

stop

3 (6)

RC

OSCILLATOR

low freq

F

1.8 U

4 (7) 2.5 V

REG

10 x

PWM

THERMAL

SHUTDOWN

POWER-UP

RESET

PROTECTION

LOGIC

overcurrent

short circuit winding

blank

6 (11)

SOURCE

0.5 V

5 (8)

AUX

0.75 V

Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.

Fig 1. Block diagram

mgt419

TEA152X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 04 — 14 September 2010

© NXP B.V. 2010. All rights reserved.

3 of 20

Share Link: