GT28F008B3-B120 Ver la hoja de datos (PDF) - Intel
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GT28F008B3-B120 Datasheet PDF : 49 Pages
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SMART 3 ADVANCED BOOT BLOCK–BYTE-WIDE
2.1 Package Pinouts
The Smart 3 Advanced Boot Block flash memory is
available in 40-lead TSOP (see Figure 1) and 48-
ball µBGA packages (see Figures 2 and 3). In
Figure 1, pin changes from one density to the next
are circled. Both packages, 40-lead TSOP and 48-
ball µBGA package, are 8-bits wide and fully
upgradeable across product densities (from 8 Mb to
16 Mb).
28F016 28F008
A16
A16
1
A15
A15
2
A14
A14
3
A13
A13
4
A12
A12
5
A11
A11
6
A9
A9
7
A8
A8
8
WE# WE#
9
RP# RP#
10
VPP
VPP
11
WP# WP#
12
A18
A18
13
A7
A7
14
A6
A6
15
A5
A5
16
A4
A4
17
A3
A3
18
A2
A2
19
A1
A1
20
40
39
38
37
36
35
34
33
Advanced Boot Block
32
40-Lead TSOP
31
10 mm x 20 mm
30
29
TOP VIEW
28
27
26
25
24
23
22
21
Figure 1. 40-Lead TSOP Package
28F008 28F016
A17
GND
NC
A19
A10
DQ7
DQ6
DQ5
DQ4
VCCQ
VCC
NC
DQ3
DQ2
DQ1
DQ0
OE#
GND
CE#
A0
A17
GND
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCCQ
VCC
NC
DQ3
DQ2
DQ1
DQ0
OE#
GND
CE#
A0
0605-01
PRELIMINARY
7
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