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Fabricante

TDA7266SA

7W + 7W DUAL BRIDGE AMPLIFIER

STMicroelectronics 

TDA7266SA

HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important

the dimensioning of the Heat Sinker RTh (°C/W).

The parameters that influence the dimensioning are:

– Maximum dissipated power for the device (Pdmax)

– Max thermal resistance Junction to case (RTh j-c)

– Max. ambient temperature Tamb max

– Quiescent current Iq (mA)

Example:

VCC = 11V, Rload = 8ohm, RTh j-c = 2.5 °C/W , Tamb max = 50°C

Pdmax

=

(N°

channels)

·

--------V----c---c---2--------

Π2

⋅

-R----l-o---a----d-

2

+

Iq

⋅

Vcc

Pdmax = 2 · ( 3.0 ) + 0.5 = 6.5 W

(Heat Sinker)

RTh c-a

=

1----5---0-----–-----T---a---m-----b----m----a---x-

Pd max

–

RTh

j-c

=

-1---5---0-----–----5----0-- – 2.5

6.5

=

12.8 ° C /W

In figure 12 is shown the Power derating curve for the device.

Figure 12. Power derating curve

25

20

(a)

15

(b)

10

(c)

5

a) Infinite Heatsink

b) 7 °C/ W

c) 10 °C/ W

0

0

40

80

120

160

Tamb (°C)

8/11

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