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Fabricante

TDA7265SA

18W+18W STEREO AMPLIFIER WITH MUTE & ST-BY

STMicroelectronics 

TDA7265SA

Figure 16. SVR vs. Frequency

Figure 18. Power Dissipation vs. Output Power

Figure 17. Attenuation vs. Pin #5 Voltage

Figure 19. Power Dissipation vs. Output Power

6 HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is im-

portant the dimensioning of the Heat Sinker RTh (°C/W).

The parameters that influence the dimensioning are:

– Maximum dissipated power for the device (Pdmax)

– Max thermal resistance Junction to case (RTh j-c)

– Max. ambient temperature Tamb max

– Quiescent current Iq (mA)

Example:

VCC = ±17.5V, Rload = 8ohm, RTh j-c = 3 °C/W , Tamb max = 50°C

Pdmax =

(N°

channels)

·

------2----V----c---c--2-------

Π2 ⋅ Rload

+ Iq ⋅ Vcc

8/12

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