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TC2117-1.8DB Ver la hoja de datos (PDF) - Microchip Technology

Número de pieza
componentes Descripción
Fabricante
TC2117-1.8DB
Microchip
Microchip Technology Microchip
TC2117-1.8DB Datasheet PDF : 18 Pages
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TC2117
TABLE 4-2:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN DDPAK PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm 2500 sq mm 2500 sq mm
*Tab of device attached to topside copper.
Thermal
Resistance
(θJA)
25°C/W
27°C/W
35°C/W
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 5.0V ± 5%
VOUTMIN = 3.3V ± 0.5%
ILOADMAX = 400 mA
TJMAX = 125°C
TAMAX = 55°C
θJA = 59°C/W (SOT-223)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= [(5.0 x 1.05) – (3.3 x .995)] 400 x 10-3
= 786 mW
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX)
θJA
= (125 – 55)
59
= 1.186W
In this example, the TC2117 dissipates a maximum of
only 786 mW; below the allowable limit of 1.186W. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input volt-
age limits.
DS21665C-page 8
© 2006 Microchip Technology Inc.

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