TA7368FG Ver la hoja de datos (PDF) - Toshiba
Número de pieza
componentes Descripción
Fabricante
TA7368FG Datasheet PDF : 12 Pages
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TA7368PG/FG
PD – Ta
1.2
※ F + PCB
1.0
TA7368PG
θj − T = 210°C / W
0.8
※ F + PCB
0.6
0.4
TA7368FG
0.2
※ F+PCB
By being mounted on certain PCB's, flat packages increase
the heat dissipating efficiency.
Data shown on the left is resulted from the measurement
on the PCB recommended by TOSHIBA.
(θj−Τ : Thermal resistance)
0
0 20 40 60 80 100 120 140 160
Ambient Temperature Ta (°C)
Printed Circuit Board
Material: Phenol resin
Thickness of copper leaf: 35µm
Plate thickness: 1.6mm
8
2006-04-28
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