TA2024 Ver la hoja de datos (PDF) - Unspecified
Número de pieza
componentes Descripción
Fabricante
TA2024 Datasheet PDF : 14 Pages
| |||
TECHNICAL INFORMATION
Power Dissipation Derating
For operating at ambient temperatures above 25°C the device must be derated based on a 150°C
maximum junction temperature, TJMAX as given by the following equation:
PDISS
=
(TJMAX − TA )
θJA
where…
PDISS = maximum power dissipation
TJMAX = maximum junction temperature of TA2024
TA = operating ambient temperature
θJA = junction-to-ambient thermal resistance
Where θJA of the package is determined from the following graph:
50
40
30
20
10
0
Θ JA vs Copper Area
1
2
3
4
5
6
Copper Area (square inches)
Pdiss - 1.35W
Pdiss - 2W
Pdiss - 3.4W
In the above graph Copper Area is the size of the copper pad on the PC board to which the heat slug
of the TA2024 is soldered. The heat slug must be soldered to the PCB to increase the maximum
power dissipation capability of the TA2024 package. Soldering will minimize the likelihood of an over-
temperature fault occurring during continuous heavy load conditions. The vias used for connecting
the heatslug to the copper area on the PCB should be 0.013” diameter.
Page 10
TA2024 Preliminary, Rev. 1.0
Share Link: 