SY88992L Ver la hoja de datos (PDF) - Micrel

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componentes Descripción

Fabricante

SY88992L

3.3V, 4.25Gbps VCSEL Driver

Micrel 

Micrel, Inc.

SY88992L

Absolute Maximum Ratings(1)

Supply Voltage (VIN) ...........................–0.5V to +4.0V

CML Input Voltage (VIN).......... VCC–1.2V to VCC+0.5V

TTL Control Input Voltage (VIN) ...................0V to VCC

Lead Temperature (soldering, 20sec.) ...........+260°C

Storage Temperature (Ts)............... –65°C to +150°C

Operating Ratings(2)

Supply Voltage (VCC).......................... +3.0V to +3.6V

Ambient Temperature (TA) ................ –40°C to +85°C

Package Thermal Resistance(3)

QFN

(θJA) Still-air.............................................. 60°C/W

(ψJB) ......................................................... 33°C/W

DC Electrical Characteristics

TA = -40°C to 85°C and VCC = 3.0V to 3.6V, unless otherwise noted. Typical values are at: VCC = 3.3V, TA = 25°C,

IMOD = 13mA(4)

Symbol Parameter

Condition

Min Typ Max Units

ICC

IMOD(4)

Power Supply Current

Modulation Current

Peaking not used

Maximum peaking used

AC-coupled

57

95

mA

70 110

mA

3

25

mA

IMOD_OFF

Modulation OFF Current

Current at MOD+ and MOD- when

the part is disabled

100

µA

VMOD_MIN

Minimum Voltage required at the

driver output (headroom) for proper

operation

1.5

V

RIN

Input Resistance (DIN+-to-DIN-)

90 100 110

Ω

VID

VIM_SET

VIL

VIH

Differential Input Voltage Swing

Voltage Range on IM_SET

/EN Input Low

/EN Input High

Input Impedance at /EN

IMOD range 3mA – 25mA(4)

200

2400 mVPP

1.2

V

0.8

V

2

V

75

kΩ

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJB

uses a 4-layer and θJA in still air unless otherwise stated.

4. IMOD is defined as the current at the output of the driver. That current splits between the pull-up network at the output and the VCSEL. For a

nominal pull-up resistor of 75Ω at the output of the driver and a nominal 50Ω VCSEL equivalent resistor, 60% of that current goes to the

VCSEL.

January 2006

4

M9999-011306-A

hbwhelp@micrel.com or (408) 955-1690

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