SX1257 Ver la hoja de datos (PDF) - Semtech Corporation

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SX1257

RF Front-End Transceiver Low Power Digital I and Q RFMulti-PHY Mode Transceiver

Semtech Corporation 

SX1257

WIRELESS & SENSING PRODUCTS

DATASHEET

3.7.3. Temperature Sensor .............................................................................................................................. 20

3.7.4. I and Q Serial Interface .......................................................................................................................... 21

3.8. Loop-Back .................................................................................................................................................... 21

3.8.1. Digital Loop-Back ................................................................................................................................... 21

3.8.2. RF Loop Back ........................................................................................................................................ 22

4. Digital Interface ..................................................................................................................................................... 23

4.1. SPI Bus Interface .......................................................................................................................................... 23

4.2. Digital IO Pin Mapping .................................................................................................................................. 24

5. Configuration and Status Registers ...................................................................................................................... 25

5.1. General Description ...................................................................................................................................... 25

5.2. Mode Configuration Registers....................................................................................................................... 26

5.3. Frequency Synthesizer Configuration Registers........................................................................................... 26

5.4. Revision Configuration Register.................................................................................................................... 27

5.5. Transmitter Front-End Configuration Registers ............................................................................................ 28

5.6. Receiver Front-End Configuration Registers ................................................................................................ 29

5.7. DIO Mapping Configuration Register ............................................................................................................ 30

5.8. Additional Parameter Configuration Registers .............................................................................................. 30

6. Application Information ......................................................................................................................................... 32

6.1. Crystal Resonator Specification .................................................................................................................... 32

6.2. Reset of the Chip .......................................................................................................................................... 32

6.2.1. POR ....................................................................................................................................................... 32

6.2.2. Manual Reset ......................................................................................................................................... 33

6.3. TX Noise Shaper........................................................................................................................................... 33

6.4. Reference Design ......................................................................................................................................... 34

7. Packaging Information .......................................................................................................................................... 35

7.1. Package Outline Drawing.............................................................................................................................. 35

7.2. Recommended Land Pattern ........................................................................................................................ 35

7.3. Thermal Impedance ...................................................................................................................................... 36

7.4. Tape and Reel Specification ......................................................................................................................... 36

8. Chip Revisions ...................................................................................................................................................... 37

9. Revision History .................................................................................................................................................... 37

SX1257 Rev 1

February 2012 ©2012 Semtech Corp.

Page 3

www.semtech.com

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