SX1231H Ver la hoja de datos (PDF) - Semtech Corporation

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SX1231H

Low Power Integrated UHF Transceiver with On-Chip +20dBm PA

Semtech Corporation 

SX1231H

ADVANCED COMMUNICATIONS & SENSING

DATASHEET

5.4.3. Rx Processing .......................................................................................................................................... 50

5.5. Packet Mode ................................................................................................................................................. 50

5.5.1. General Description.................................................................................................................................. 50

5.5.2. Packet Format .......................................................................................................................................... 51

5.5.3. Tx Processing (without AES).................................................................................................................... 53

5.5.4. Rx Processing (without AES) ................................................................................................................... 54

5.5.5. AES .......................................................................................................................................................... 54

5.5.6. Handling Large Packets ........................................................................................................................... 56

5.5.7. Packet Filtering......................................................................................................................................... 56

5.5.8. DC-Free Data Mechanisms ...................................................................................................................... 58

6. Configuration and Status Registers ...................................................................................................................... 60

6.1. General Description ...................................................................................................................................... 60

6.2. Common Configuration Registers ................................................................................................................. 63

6.3. Transmitter Registers .................................................................................................................................... 66

6.4. Receiver Registers........................................................................................................................................ 67

6.5. IRQ and Pin Mapping Registers.................................................................................................................... 69

6.6. Packet Engine Registers............................................................................................................................... 71

6.7. Temperature Sensor Registers ..................................................................................................................... 74

6.8. Test Registers ............................................................................................................................................... 74

7. Application Information ......................................................................................................................................... 75

7.1. Crystal Resonator Specification .................................................................................................................... 75

7.2. Reset of the Chip .......................................................................................................................................... 75

7.2.1. POR.......................................................................................................................................................... 75

7.2.2. Manual Reset ............................................................................................................................................ 76

7.3. Reference Design ......................................................................................................................................... 76

8. Packaging Information .......................................................................................................................................... 79

8.1. Package Outline Drawing.............................................................................................................................. 79

8.2. Recommended Land Pattern ........................................................................................................................ 79

8.3. Thermal Impedance ...................................................................................................................................... 80

8.4. Tape & Reel Specification............................................................................................................................. 80

9. Revision History .................................................................................................................................................... 81

Rev 1 - Oct 2011

Page 4

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