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STV7622BMP Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
STV7622BMP
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STV7622BMP Datasheet PDF : 32 Pages
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Pinout description
4
Pinout description
Figure 4. Pinout diagram
VSSP1
VSSP2
VSSP3
VPP1
VPP2
VPP3
DUMMY
VSSLOG1
VSSSUB1
VDD1
VCC1
Y
0/0
X
STV7622
VSSP4
VSSP5
VSSP6
VPP4
VPP5
VPP6
DUMMY
VSSLOG2
VSSSUB2
VDD2
VCC2
DUMMY
In the pinout diagram of Figure 4 above:
q VDD1 to VDD8 are internally connected. It is not necessary to connect them together
on the tape carrier package (TCP) - the same applies to VCC1 and VCC2.
q VSSLOG1 to VSSLOG2 are internally connected. It is not necessary to connect them
together on the TCP - the same for VSSSUB1 and VSSSUB2.
q VSSLOG1 to VSSLOG7 are not internally connected to VSSSUB1 and VSSSUB2. We
recommend shorting them together very close to the die, either on the TCP or at the
TCP connector.
q VDD1 to VDD8 are not internally connected to VCC1 and VCC2. For good test
coverage, they must not be shorted together on the TCP. In the application, VDD1 to
VDD8, VCC1 and VCC2 must be connected together at the TCP connector level.
q TEST1 and TEST2 are used to test the device. For good test coverage, they must not
be shorted together on the TCP. In the application, TEST1 and TEST2 must be
grounded at the TCP connector level.
q VREF must be connected to ground via a 10nF filter capacitor.
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