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STTH6010 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
STTH6010
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STTH6010 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Package information
2
Package information
STTH6010
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.80 Nm
Maximum torque value: 1.0 Nm
Table 5. DO-247 dimensions
DIMENSIONS
V
V
H
L5
L
L3
V2
F
G
Dia
A
L2
F2 L1
F3
L4
D
M
E
REF.
Millimeters
Inches
Min.
Max Min.
Max.
A 4.85
5.15 0.191
0.203
D 2.20
2.60 0.086
0.102
E 0.40
0.80 0.015
0.031
F 1.00
1.40 0.039
0.055
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M 2.00
3.00 0.078
0.118
V
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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