STPS10L40CT/CG/CF
Fig. 7: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
100.0
10.0
Tj=150°C
Typical values
1.0
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit boardFR4, copperthickness: 35µm)( D2PAK).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 4 8 12 16 20 24 28 32 36 40
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
A
C
L7
D
M
E
REF.
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min. Max.
4.40 4.60
1.23 1.32
2.40 2.72
0.49 0.70
0.61 0.88
1.14 1.70
1.14 1.70
4.95 5.15
2.40 2.70
10 10.40
16.4 typ.
13
14
2.65 2.95
15.25 15.75
6.20 6.60
3.50 3.93
2.6 typ.
3.75 3.85
Min. Max.
0.173 0.181
0.048 0.051
0.094 0.107
0.019 0.027
0.024 0.034
0.044 0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
0.511 0.551
0.104 0.116
0.600 0.620
0.244 0.259
0.137 0.154
0.102 typ.
0.147 0.151
4/6