SSD1858 Ver la hoja de datos (PDF) - Unspecified
Número de pieza
componentes Descripción
Fabricante
SSD1858 Datasheet PDF : 50 Pages
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5
DIE ARRANGEMENT
188
Pad355
DUMMY
DUMMY
DUMMY
COM16
COM15
:
:
:
:
COM1
COM0
ICONR
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
COL0
COL1
:
:
:
:
:
:
:
:
:
:
COL102
COL103
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
COM32
COM33
:
:
:
:
COM48
COM49
DUMMY
DUMMY
DUMMY
SSD1858
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
TEST14
CL
M
CL
SYNC
VOUT
VOUT
:
VOUT
VOUT
VSS
VSS
:
VSS
VSS
CVSS
CVSS
:
CVSS
CVSS
RVSS
RVSS
VCI
VCI
:
VCI
VCI
VDD
VDD
:
VDD
VDD
VL5
VL4
VL3
VL2
TEST13
TEST12
TEST11
TEST10
TEST9
TEST8
TEST7
TEST6
TEST5
TEST4
TEST3
TEST2
TEST1
TEST_IN1
VSS
MODE
VDD
TEST_IN0
VSS
MID2
VDD
MID1
VSS
MID0
VDD
D/C#
D/C#
D/C#
RES#
VSS
CS#
CS#
VDD
D0
D7
D7
D7
D6
D6
D6
D5
D4
D3
D2
D1
D0
D7
D7
VDD
E(RD#)
E(RD#)
R/W(WR#)
R/W(WR#)
VSS
D/C#
D/C#
D/C#
RES#
VDD
CS#
CS#
VSS
PS1
VSS
PS0
VDD
SYNC
M
CL
TEST0
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
DUMMY
Pad168
30 x VOUT
9 x VSS
15 x CVSS
20 x VCI
11 x VDD
Pad1
Note:
1. Diagram showing the die face up.
2. Coordinates are reference to center of the
chip.
3. Unit of coordinates and Size of all
alignment marks are in um.
4. All alignment keys do not contain gold
bump.
25
25
25
25
25
100
25
100
25
25
25
25
100
50
100
75
18
100
100
Die size: 11.66 x 1.41 mm2
Die Thickness: 533±25µm
Bump Height: Normally 18µm
Bump co-planarity < 3 µm (within die)
Rev 1.1
09/2002
Figure 2 – SSD1858 Pin Assignment
4
SOLOMON
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