SSD1852Z Ver la hoja de datos (PDF) - Solomon Systech

Número de pieza

componentes Descripción

Fabricante

SSD1852Z

LCD Segment / Common Driver With Controller

Solomon Systech  

5 DIE PAD ARRANGEMENT

Note:

1.

2.

3.

4.

Diagram showing the face of the

die.

Coordinates are reference to

center of the chip.

Unit of coordinates and Size of all

alignment marks are in µm.

All alignment keys do not contain

gold bump.

25

25

25

25

25

100

25

100

25

25

25

25

100

50

100

75

18

100

SSD1852

Rev 1.0

01/2003

100

Die Size: 10.49 mm x 1.72mm

Die Thickness: 533±25µm

Bump Height: Typical 18µm

Bump co-planarity <3µm (within die)

Figure 2 - Die Pad Assignment

4

SOLOMON

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