SSAG230400 Ver la hoja de datos (PDF) - ALPS ELECTRIC CO.,LTD.
Número de pieza
componentes Descripción
Fabricante
SSAG230400 Datasheet PDF : 5 Pages
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Slide Switches Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. T emperature measurement: T hermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Series（Reflow type）
Vertical
1-pole, 3-position
SSSS2
1-pole, 2-position
Horizontal 1-pole, 3-position
2-pole, 3-position
Vertical
1-pole, 2-position
SSSS7
SSAH, SSAG, SSAJ, SSAL, SSSS8
A（℃）
3s max.
B（℃）
260
250
260
230
C（s）
40
D（℃）
E（℃）
180
150
F（s）
120
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the
PC board’s temperature greatly differs from that of the switch, depending on the PC board’s material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly
recommended.
Reference for Hand Soldering
Series
SSSF, SSSU
SSSS2
SSSS9
SSAH, SSAG, SSAJ, SSAL
SSSS8
SSSS7
SSAC
Reference for Dip Soldering
(For PC board terminal types)
Series
SSSS2
SSSS9
SSSF, SSSU
SSAC
Soldering temperature
350±10℃
350±10℃
350±10℃
350±5℃
330±5℃
320±5℃
300±10℃
Soldering time
3+1/0s
4s max.
3s max.
3s max.
3s max.
3s max.
2s max.
Items
Preheating temperature
Preheating time
100℃ max.
60s max.
120℃ max.
60s max.
100℃ max.
60s max.
100℃ max.
60s max.
Dip soldering
Soldering temperature Duration of immersion
260±5℃
3±1s
260±5℃
5+0/-1s（2 times）
260±5℃
10±1s/5±1s
260±5℃
5±1s
111
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