SPF-3143 Ver la hoja de datos (PDF) - Sirenza Microdevices => RFMD
Número de pieza
componentes Descripción
Fabricante
SPF-3143 Datasheet PDF : 3 Pages
| |||
Pin #
1
2
3
4
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed. ESD class rating to be
determined.
Pin Description
Function
Gate
Source
Drain
NC
Description
RF Input / Gate Bias
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output / Drain Bias
No Connection / Recommend grounding pin
Pin Designation
4
3
Preliminary
SPF-3143 Low Noise pHEMT GaAs FET
Part Number Ordering Information
Part Number
SPF-3143
Reel Size
7"
Devices/Reel
3000
Part Symbolization
The part will be symbolized with the “F31”
designator and a dot signifying pin 1 on the top
surface of the package.
Recommended PCB Layout
SOT-343
Package
1
2
Plated Thru
Holes
(0.020" DIA)
Ground
Plane
Use multiple plated-through vias holes located
close to the package pins to ensure a good RF
ground connection to a continuous groundplane
on the backside of the board.
D
e
e
HE CL
F31
CL
b
b1
Package Dimensions
L
E
Q1
C
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
A2
A
2. DIMENSIONS ARE INCLUSIVE OF PLATING.
3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH
& METAL BURR.
4. ALL SPECIFICATIONS COMPLY TO EIAJ SC70.
A1
5. DIE IS FACING UP FOR MOLD AND FACING DOWN
FOR TRIM/FORM. ie :REVERSE TRIM/FORM.
6. PACKAGE SURFACE TO BE MIRROR FINISH.
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
b1
c
L
NOM
1.25
2.05
2.10
1.05
0.90
0.05
0.25
0.65
0.375
0.675
0.14
0.20
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
3
http://www.sirenza.com
EDS-103162 Rev B
Share Link: 