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HFBR-5204 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza
componentes Descripción
Fabricante
HFBR-5204 Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
,
NO INTERNAL CONNECTION
,
NO INTERNAL CONNECTION
HFBR-520X
TOP VIEW
Rx
Rx Tx
Tx
VEE RD RD SD VCC VCC TD TD VEE
1
2
3
4
5
6
7
8
9
C1
C2
VCC
L1 L2
R2 R3
TERMINATION
,,,, AT PHY
DEVICE
INPUTS
VCC
R5 R7
C6
R6
R8
C3
C4
VCC FILTER
AT VCC PINS
TRANSCEIVER
R9
R10
R1
R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
RD RD SD
VCC
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout - Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource
announcement which defined the
1x9 package style. This drawing
is reproduced in Figure 8 with the
addition of ANSI Y14.5M
compliant dimensioning to be
used as a guide in the mechanical
layout of your circuit board.
113

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