SURFACE MOUNT LED LAMPS
Low Current Type (IF≦10mA) Mini-molded chip LEDs
SML-211 Series
Package Size
(mm)
Yellow
590nm
Orange
AlGaInP on GaAs
611nm
Red
630nm
2012
(0805)
2.0×1.25
t=0.8
SML-211YT
SML-211DT
SML-211UT
■ Absolute Maximum Ratings(Ta=25℃)
Part No.
Emitting
color
Power
dissipation
PD
(mW)
Forward
current
IF
(mA)
Peak
forward
current
*IFP
(mA)
Reverse Operating Stotage
voltage temperature temperature
VR
Topr
Tstg
(V) (°C)
(°C)
SML-211YT Yellow
SML-211DT Orange
44
20
60
SML-211UT
Red
*IFP measured under duty ≦1/ 5,pulse width ≦1ms.
4
-30 to +85 -40 to +85
■ External Dimensions(Unit:mm)
2.0
+0.2
0
1.4
Cathode mark
■ Electrical Optical Characteristics(Ta=25℃)
Part No.
SML-211YT
SML-211DT
SML-211UT
Forward
voltage
Resin Color
VF
Reverse
current
IR
Typ. IF Max. VR
(V) (mA) (µA) (V)
Transparent
Clear
1.8
2 100 4
Light wavelength
Peak Half-wave
λp ∆λ
Typ. Typ. IF
(nm) (nm) (mA)
Brightness
IV
Min. Typ. IF
(mcd) (mcd) (mA)
590 15
1.4 4
611 16 2
2
0.9 2.5
630 18
1.2
Terminal
Tolerance:±0.1
■ Directivity
X’
Y’
0°
30°
30°
60°
60°
90°
100
50
0
50
Relative brightness (%)
90°
100
(Typ.)
■ Recommemded Pad Layout
■ Packaging Spacifications(Unit:mm)
Tape Spacifications:T86〈3,000pcs/reel〉
1.1
Feeding direction
4
2
φ1.5
(Unit:mm)
The recommended thickness of the screen mask
for soldering is between 100 and 200μm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
1.7
1.0
Reel Spacifications
φ13
φ60
φ180