SMBJ5923E3/TR13 Ver la hoja de datos (PDF) - Microsemi Corporation
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SMBJ5923E3/TR13 Datasheet PDF : 3 Pages
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SCOTTSDALE DIVISION
SMBG5913 thru SMBG5956B
SMBJ5913 thru SMBJ5956B
SILICON 3.0 Watt ZENER DIODES
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 3.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 3.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections.
Microsemi also offers numerous other Zener products to meet higher and
lower power applications.
APPEARANCE
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
• Surface mount equivalent to 1N5913 to 1N5956B
• Ideal for high-density and low-profile mounting
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating
current and temperature range
• Wide selection from 3.3 to 200 V
• Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
• Nonsensitive to ESD per MIL-STD-750 Method
1020
• Withstands high surge stresses (see Figure 2)
• Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MAXIMUM RATINGS
• Power dissipation at 25ºC: 3.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+150ºC
• Thermal Resistance: 25 ºC/W junction to lead, or
90ºC/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
• Steady-State Power: 3 watts at TL < 75oC, or
1.38 watts at TA = 25ºC when mounted on FR4
PC board with recommended footprint (also see
Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Gull-wing or C-bend (modified J-
bend) leads, tin-lead plated solderable per MIL-
STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode
to be operated with banded end positive with
respect to opposite end for Zener regulation
• MARKING: Includes part number without prefix
(e.g. 5913B, 5948C, 5956D, etc.)
• TAPE & REEL option: Standard per EIA-481-2
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.1 grams
• See package dimensions on last page
Copyright 2002
6-04-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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