SM802121UMG Ver la hoja de datos (PDF) - Micrel
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SM802121UMG Datasheet PDF : 10 Pages
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Micrel, Inc.
Absolute Maximum Ratings(1)
Supply Voltage (VDD, VDDO) .........................................+4.6V
Input Voltage (VIN) ...............................0.50V to VDD + 0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) ......................... 65C to 150°C
SM802121
Operating Ratings(2)
Supply Voltage (VDD, VDDO).................. +2.375V to +3.465V
Ambient
Junction
TTehmerpmearal tRueresi(sTtaAn) .c..e..(3..)...................
40°C
to
+85°C
QFN (JA)
Still-Air......................................................... 50°C/W
QFN (JB)
Junction-to-Board ....................................... 30°C/W
DC Electrical Characteristics(4)
VDD = VDDO = 3.3V 5% or 2.5V 5%
VDD = 3.3V 5%, VDDO= 3.3V 5% or 2.5V 5%
TA = 40C to 85C.
Symbol
VDD, VDDO
VDD, VDDO
Parameter
2.5V Operating Voltage
3.3V Operating Voltage
Condition
IDD
Supply Current VDD + VDDO XTAL_SEL = 0; REF_IN source, outputs open
Min.
2.375
3.135
Typ.
2.5
3.3
78
Max.
2.625
3.465
Units
V
V
100
mA
IDD
Supply Current VDD + VDDO XTAL_SEL = 1; CRYSTAL source, outputs open
88
114
mA
LVPECL DC Electrical Characteristics(4)
VDD = VDDO= 3.3V 5% or 2.5V 5%
VDD = 3.3V 5%, VDDO = 3.3V 5% or 2.5V 5%
TA = 40C to 85C. RL = 50Ω to VDDO 2V
Symbol Parameter
Condition
VOH
Output High Voltage
VOL
Output Low Voltage
VSWING
Output Voltage Swing
Min.
VDDO 1.145
VDDO 1.945
0.6
Typ.
VDDO 0.97
VDDO 1.77
0.8
Max.
VDDO 0.845
VDDO 1.645
1.0
Units
V
V
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
January 2012
4
M9999-011212-A
hbwhelp@micrel.com or (408) 955-1690
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