SFH615A-1X007 Ver la hoja de datos (PDF) - Vishay Semiconductors
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SFH615A-1X007 Datasheet PDF : 10 Pages
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SFH615A/SFH6156
Vishay Semiconductors
Thermal Characteristics
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the tem-
peratures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB,
layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's Thermal Characteristics
of Optocouplers Application note.
Parameter
LED Power dissipation
Output Power dissipation
Maximum LED junction temperature
Maximum output die junction temperature
Thermal resistance, Junction Emitter to Board
Thermal resistance, Junction Emitter to Case
Thermal resistance, Junction Detector to Board
Thermal resistance, Junction Detector to Case
Thermal resistance, Junction Emitter to Junction Detector
Thermal resistance, Board to Ambient*
Thermal resistance, Case to Ambient*
Test condition
at 25 °C
at 25 °C
Symbol
Pdiss
Pdiss
Tjmax
Tjmax
θEB
θEC
θDB
θDC
θED
θBA
θCA
Value
100
150
125
125
173
149
111
127
95
195
3573
Unit
mW
mW
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
* For 2 layer FR4 board (4" x 3" x 0.062)
TA
θ
CA
TC
θ
DC
TJD
θ
DE
Package
θ
EC
TJE
θ
DB
19996
θ
EB
TB
θ
BA
TA
Document Number 83671
Rev. 2.0, 06-Sep-06
www.vishay.com
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