SC4519 Ver la hoja de datos (PDF) - Semtech Corporation
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SC4519 Datasheet PDF : 15 Pages
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SC4519
POWER MANAGEMENT
Application Information (Cont.)
Layout Guidelines:
Mag
ωp1
ωZ
Loop gain T(s)
Power stage
ωC
ωP2
ω
Figure 4. Asymptotic diagrams of power stage with
current loop closed and its loop gain.
The design guidelines for the SC4519 applications are
as following:
1. Set the loop gain crossover corner frequency ωC for
given switching corner frequency ωC = 2πfC
2. Place an integrator at the origin to increase DC and
low frequency gains.
3. Select ωZ such that it is placed at ωP1 to obtain a
-20dB/dec rate to go across the 0dB line.
4. Place a high frequency compensator pole
ωP2 (ωP2 = πfs) to get the maximum attenuation of
the switching ripple and high frequency noise with
the adequate phase lag at ωC.
In order to achieve optimal electrical and thermal
performance for high frequency converters, special
attention must be paid to the PCB layouts. The goal of
layout optimization is to identify the high di/dt loops and
minimize them. The following guidelines should be used
to ensure proper operation of the converters.
1. A ground plane is suggested to minimize switching
noises and trace losses and maximize heat
transferring.
2. Start the PCB layout by placing the power components
first. Arrange the power circuit to achieve a clean
power flow route. Put all power connections on one
side of the PCB with wide copper filled areas if
possible.
3. The VIN bypass capacitor should be placed next to
the VIN and GND pins.
4. The trace connecting the feedback resistors to the
output should be short, direct and far away from any
noise sources such as switching node and switching
components.
5. Minimize the loop including input capacitor, the
SC4519 and freewheeling diode D2. This loop passes
high di/dt current. Make sure the trace width is wide
enough to reduce copper losses in this loop.
6. Maximize the trace width of the loop connecting the
inductor, freewheeling diode D2 and the output
capacitor.
7. Connect the ground of the feedback divider and the
compensation components directly to the GND pin
of the SC4519 by using a separate ground trace.
8. Connect Pin 4 to a large copper area to remove the
IC heat and increase the power capability of the
SC4519. A few feedthrough holes are required to
connect this large copper area to a ground plane to
further improve the thermal environment of the
SC4519. The traces attached to other pins should
be as wide as possible for the same purpose.
2007 Semtech Corp.
11
www.semtech.com
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