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SC4612 Ver la hoja de datos (PDF) - Semtech Corporation

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SC4612 Datasheet PDF : 24 Pages
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SC4612
POWER MANAGEMENT
Pin Descriptions
Pin # Pin#
MLPD SOIC
Pin Name Pin Function
1, 7
NC
No connection.
1
2
ILIM
The current limit programing resistors (R2 & R3) in conjunction with an internal current
source, program the current limit threshold for the low side MOSFET RDS-ON
sensing. Once the voltage drop across the Low side MOSFET is larger than the drop
across the programmed value, current limit condition occurs, and the hiccup current limit
protection is activated.
2
3
OSC
Oscillator Frequency set pin. An external capacitor to GND will program the oscillator
frequency. See Table "Frequency vs. COSC" on page 14 to determine oscillator
frequency.
3
4
SS/EN
Soft start pin. Internal current source connected to a single external capacitor will
determine the soft-start duration for the output. Inhibits the chip if pulled down.
TSS
CSS X 1.2
ISS
4
5
5
8
EAO
FB
Error Amplifier output. A compensation network is connected from this pin to FB.
The inverting input of the error amplifier. Feedback pin is used to sense the output
voltage via a resistive divider.
6
6
VDD
Bias supply ranging from 4.5V to 28V, VDD pin is initially used to provide the base
drive to the internal pass transistor to regulate the DRV.
7
9
8
10
GND
DL
Ground.
DL signal (Drive Low). Gate drive for bottom MOSFET.
9
11
DRV
DRV supplies the output MOSFETs gate drive, and the chip analog circuitry. This pin
should be bypassed with a 2.2µF ceramic capacitor to GND. DRV is internally regulated
from the external supply connected to VDD. If VDD is below 10V , the supply could be
directly connected to the DRV pin.
10
12
11
13
BST
DH
BST signal. Supply for high side driver; can be directly connected to an external supply
or to a bootstrap circuit.
DH signal (Drive High). Gate drive for top MOSFET.
12
14
PHASE The return path for the high side gate drive, also used to sense the voltage at the phase
node for adaptive gate drive protection, and the low-side RDS-ON voltage sensing.
X
-
THERMAL Pad for heatsinking purposes. Connect to ground plane using multiple vias.
PAD (GND)
2007 Semtech Corp.
7
www.semtech.com

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