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SC2595 Ver la hoja de datos (PDF) - Semtech Corporation

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SC2595 Datasheet PDF : 12 Pages
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POWER MANAGEMENT
Application Information (Cont.)
Layout guidelines
1)The SC2595 has a SOIC8-EDP package. It can improve
the thermal impedance (θJC) significantly. A suitable ther-
mal pad should be added when PCB layout. Some ther-
mal vias are required to connect the thermal pad to the
PCB ground layer. This will improve the thermal perfor-
mance .
2)To increase the noise immunity, a ceramic capacitor of
10nf to 100nf is required to decouple the VREF pin with
the shortest connection trace, also A 10nF to 100nF
ceramic capacitor close to the VSENSE pin is required to
avoid oscillation during transient condition.
3)To reduce the noise on the input power rail for stan-
dard SSTL-2 application, a 68μF low ESR capacitor and
a 1μF ceramic capacitor have to be used on the input
power rail with shortest possible connection.
4)For lower power loss SSTL-2 application, a 220μF AL.
capacitor (ESR should be lower than 250m ohm) and a
10μF ceramic has to be added on the PVCC pin and a 1μF
ceramic capacitor +5.1 ohm filter has to be added on
the VDDQ pin with shortest possible connection.
5)VTT output copper plane should be as large as possible.
6)VSENSE trace should be as short as possible.
SC2595
©2009 Semtech Corp.
7
www.semtech.com

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