SC2595(2007) Ver la hoja de datos (PDF) - Semtech Corporation
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SC2595 Datasheet PDF : 11 Pages
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SC2595
POWER MANAGEMENT
Outline Drawing - Power SOIC-8L
A
N
2X E/2
e
D
E1 E
12
ccc C
2X N/2 TIPS
e/2
B
aaa C
SEATING
PLANE
C
D
A2 A
A1
bxN
bbb C A-B D
F
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .053 - .069 1.35 - 1.75
A1 .000 - .005 0.00 - 0.13
A2 .049 - .065 1.25 - 1.65
b .012 - .020 0.31 - 0.51
c .007 - .010 0.17 - 0.25
D .189 .193 .197 4.80 4.90 5.00
E1 .150 .154 .157 3.80 3.90 4.00
E
.236 BSC
6.00 BSC
e
.050 BSC
1.27 BSC
F .086 .090 .094 2.19 2.29 2.39
h .010 - .020 0.25 - 0.50
L .016 .028 .041 0.40 0.72 1.04
L1
(.041)
(1.05)
N
8
8
01 0
-
8
0
-
8
aaa
.004
0.10
bbb
.010
0.25
ccc
.008
0.20
h
EXPOSED PAD
H
F
GAGE
PLANE
h
c
0.25
L
(L1)
01
SIDE VIEW
SEE DETAIL A
DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION BA.
Land Pattern - Power SOIC-8L
E
D
(C) F
THERMAL VIA
P
? 0.36mm
SOLDER MASK
Z
G
Y
X
DIM
C
D
E
F
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.205)
(5.20)
.098
2.49
.201
.096
.118
.050
.024
.087
.291
5.10
2.44
3.00
1.27
0.60
2.20
7.40
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
Contact Information
© 2007 Semtech Corp.
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
11
www.semtech.com
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