SC1458
Applications Information (continued)
PCB Layout Considerations
While layout for linear devices is generally not as critical
as for a switching application, careful attention to detail
will ensure reliable operation.
• Attach the part to a large copper footprint,
particularly the thermal pad on the underside
of the device, to enable better heat transfer,
particularly on PCBs where there are
internal power and ground planes.
• Place the input, output, and bypass capacitors
close to the device for optimal transient
response and device behavior.
• Connect all ground connections directly to the
ground plane whenever possible to minimize
ground potential differences on the PCB.
• Ensure that the feedback resistors are placed as
close as possible to the feedback pins.
COUTB
CIN
SC1458B
CBYP
COUTA
11