SAA6581 Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
SAA6581 Datasheet PDF : 15 Pages
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Philips Semiconductors
RDS/RBDS demodulator
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 7.5 mm
Product specification
SAA6581
SOT162-1
D
y
Z
16
c
9
E
A
X
HE
vM A
pin 1 index
1
e
8
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT162-1
IEC
075E03
REFERENCES
JEDEC
JEITA
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
2003 Oct 10
10
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