SAA7390 Ver la hoja de datos (PDF) - Philips Electronics

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SAA7390

High performance Compact Disc-Recordable (CD-R) controller

Philips Electronics 

Philips Semiconductors

High performance Compact

Disc-Recordable (CD-R) controller

CONTENTS

11.1

11.2

1

FEATURES

11.3

1.1

General

11.4

1.2

Interface logic (CD-ROM operation)

11.5

1.3

Hardware third-level error correction

11.6

1.4

Interface logic (CD-R operation)

11.7

1.5

DRAM buffer controller (256 kbytes × 8,

12

1 Mbyte × 8, 4 Mbytes × 8)

1.6

Additional product support

13

2

GENERAL DESCRIPTION

14

3

QUICK REFERENCE DATA

15

4

ORDERING INFORMATION

15.1

15.2

5

BLOCK DIAGRAM

15.3

6

PINNING

15.4

7

FUNCTIONAL DESCRIPTION

15.5

15.6

7.1

Input clock doubler

15.7

7.2

Block encoder

15.8

7.3

Front-end

15.9

7.4

Track descriptor block

7.5

Buffer manager

16

8

MICROCONTROLLER INTERFACE

17

8.1

Microprocessor interface status register

8.2

Microcontroller interface command register

17.1

8.3

Microprocessor interrupts

17.2

8.4

Microcontroller RAM organization

17.3

17.4

9

FRONT PANEL AND MISCELLANEOUS

CONTROL SIGNALS

18

9.1

S2B UART registers

19

9.2

SPI UART registers

9.3

Track Descriptor Block (TDB) generation

9.4

Miscellaneous control registers

10

FRONT-END

10.1

Minute-second frame addressing and header

information

10.2

Front-end status and control

11

BUFFER MANAGER

Preliminary specification

SAA7390

Front-end to buffer manager interface

Microcontroller to buffer manager interface

ECC to buffer manager interface

SCSI to buffer manager interface

Miscellaneous buffer manager considerations

Host interface related registers

CDB2 related registers

FRAME BUFFER ORGANIZATION

SUMMARY OF CONTROL REGISTER MAP

LIMITING VALUES

OPERATING CHARACTERISTICS

I2S-bus timing; data mode

EIAJ timing; audio mode

R-W timing (see Fig.17)

C-flag timing (see Fig.18)

S2B interface timing

SPI interface timing

Microprocessor interface

Host interface

DRAM interface (the SAA7390 is designed to

operate with standard 70 ns DRAMs)

PACKAGE OUTLINE

SOLDERING

Introduction

Reflow soldering

Wave soldering

Repairing soldered joints

DEFINITIONS

LIFE SUPPORT APPLICATIONS

1996 Jul 02

2

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