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Fabricante

SA58631

3 W BTL audio amplifier

Philips Electronics 

Philips Semiconductors

13. Application information

SA58631

3 W BTL audio amplifier

C1

1 µF

R1

11 kΩ

VI

R2

56 kΩ

IN− 4

IN+ 3

SVR 2

C2

47 µF

MODE

1

6

SA58631

100 nF

OUT−

5

RL

8 OUT+

7

GND

VCC

100 µF

002aac007

Gain = 2 × R----2--

R1

Fig 3. Application diagram of SA58631 BTL differential output configuration

14. Test information

14.1 Test conditions

The junction to ambient thermal resistance, Rth(j-a) = 27.7 K/W for the HVSON8 package

when the exposed die attach paddle is soldered to 5 square inch area of 1 ounce copper

heat spreader on the demo PCB. The maximum sine wave power dissipation for

Tamb = 25 °C is:

1---5---0-----–----2---5-- = 4.5 W .

27.7

Thus, for Tamb = +85 °C the maximum total power dissipation is:

1---5---0-----–----8---5-- = 2.35 W .

27.7

The power dissipation versus ambient temperature curve (Figure 5) shows the power

derating profiles with ambient temperature for three sizes of heat spreaders. For a more

modest heat spreader using 1.5 square inch area on the top side of the PCB, the

Rth(j-a) is 31.25 K/W. When the package is not soldered to a heat spreader, the Rth(j-a)

increases to 83.3 K/W.

SA58631

Preliminary data sheet

Rev. 01 — 1 December 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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