RT9052GE Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Fabricante
RT9052GE Datasheet PDF : 9 Pages
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RT9052
0.45
Single-Layer PCB
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve for RT9052 Package
Layout Consideration
There are three critical layout considerations.
` The current setting resistor should be located as close
as possible to the RT9052 to avoid inducing any noise.
` The input capacitor have to put at near the IC for improved
performance.
` The pass element operating under high power situation
may raise the junction temperature above the package
thermal resistance limit. (copper area can be added to
improve power dissipation.)
VLED
Place CIN near the
IC for improved
performance
CIN VCC
WLED
DRI
RB
ISET node copper
area should be
minimized and kept far
away from noise
sources
DIM
6 VCC
GND 2 5 DRI
ISET 3
RISET
GND
4 FAULT
5V
R1
The GND plane
should be connected
to a strong ground
plane for heat sinking
and noise protection.
Figure 2. PCB Layout Guide
www.richtek.com
8
DS9052-01 April 2011
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