RT8251GSP Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Fabricante
RT8251GSP Datasheet PDF : 16 Pages
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RT8251
Electrical Characteristics
(VIN = 12V, TA = 25°C unless otherwise specified)
Parameter
Symbol
Feedback Reference Voltage
High-Side Switch-On Resistance
VFB
RDS(ON)1
Low-Side Switch-On Resistance
High-Side Switch Leakage
RDS(ON)2
Current Limit
ILIM
Current Sense Transconductance GCS
Error Amplifier Tansconductance gm
Oscillator Frequency
fSW
Short Circuit Oscillation Frequency
Maximum Duty Cycle
DMAX
Minimum On-Time
tON
UVLO Threshold Rising
UVLO Threshold Hysteresis
EN Input Voltage
Logic Low VIL
Logic High VIH
Enable Pull Up Current
Shutdown Current
Quiescent Current
Soft-Start Current
ISHDN
IQ
ISS
Soft-Start Period
Thermal Shutdown
TSD
Test Conditions
4.75V ≦ VIN ≦ 24V
VEN = 0V, VSW = 0V
Duty = 85%; VBOOT−SW = 4.8V
Output Current to VCOMP
ΔIC = ±10μA
VFB = 0V
VFB = 0.7V
VEN = 0V
VEN = 0V
VEN = 2V, VFB = 1V
VSS = 0V
CSS = 10nF
Min Typ Max Unit
0.784 0.8 0.816 V
--
70
-- mΩ
--
15
--
Ω
--
--
10 μA
-- 6.8 --
A
-- 4.6 -- A/V
-- 920 -- μA/V
420 570 720 kHz
-- 185 -- kHz
--
85
--
%
-- 100 --
ns
-- 4.1 --
V
-- 200 -- mV
--
-- 0.4
V
1.4 -- 5.5
--
1
--
μA
--
25
--
μA
-- 0.8 1 mA
--
10
--
μA
--
1
-- ms
-- 150 --
°C
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS8251-04 February 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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