WS128K32-XG4TX Ver la hoja de datos (PDF) - White Electronic Designs => Micro Semi
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WS128K32-XG4TX Datasheet PDF : 9 Pages
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WS128K32-XXX /
EDI8C32128C
ORDERING INFORMATION
NOTE: For non-SMD new designs, please use the WS128K32-XXX part number for inquiries and orders.
W S 128K 32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
G4T = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power *
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE MICROELECTRONICS
EDI 8 C 32 128 C X X X
ELECTRONIC DESIGNS
SRAM
CERAMIC MCM
ORGANIZATION, 128Kx32
TECHNOLOGY:
C = CMOS Standard Power
LP = Low Power *
ACCESS TIME (ns)
PACKAGE TYPE:
E = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
G = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
DEVICE GRADE:
B = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
* Low Power Data Retention only available in G2T/E Package Type
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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