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RMPA2271 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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RMPA2271 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
PRELIMINARY
May 2005
RMPA2271
WCDMA/UMTS Power Edge™ Power Amplifier
Module with Integrated Power Detector
Features
Temperature compensated, integrated power detector with
>20dB dynamic range
41% WCDMA efficiency at +28dBm average output power
1920–1980MHz
Meets UMTS/WCDMA and HSDPA performance
requirements
Compact Lead-free compliant LCC package–
(3.0 x 3.0 x 1.0 mm nominal)
Single positive-supply operation and low power and
shutdown modes
Low Vref (2.85V) compatible with advanced handset
chipsets
Internally matched to 50and DC blocked RF
input/output
Device
General Description
The RMPA2271 Power Amplifier Module (PAM) is Fairchild’s
latest innovation in 50matched, surface mount modules
targeting WCDMA/UMTS applications. Answering the call for
integrated Power Detection, the RMPA2271 offers the ability to
measure power output over a 20dB range. This feature
eliminates the need of an external power detector and lossy
directional coupler, improving system perfomance and reducing
overall cost. Simple two-state Vmode control is all that is
needed to change the PA optimization from high power to low
power mode to minimize current usage. The 3 x 3 x 1.0mm LCC
package fits into the tightest spaces available on handset
boards and is footprint compatible with existing 3 x 3mm LCC
power amplifiers. The multi-stage GaAs Microwave Monolithic
Integrated Circuit (MMIC) is manufactured using Fairchild’s
InGaP Heterojunction Bipolar Transistor (HBT) process.
Functional Block Diagram
Vcc1 11
RF IN 22
Vmode 33
Vref 44
MMIC
Input
Match
DC Bias Control
Power Detector
88 Vcc2
Output
Match
77
RF OUT
66 GND
55 Pdet
©2005 Fairchild Semiconductor Corporation
1
RMPA2271 Rev. B
www.fairchildsemi.com

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