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RC1585(2001) Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza
componentes Descripción
Fabricante
RC1585
(Rev.:2001)
Fairchild
Fairchild Semiconductor Fairchild
RC1585 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
RC1585
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
PRODUCT SPECIFICATION
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electri-
cally isolated and include its contribution to the total thermal
resistance. The cases of the RC1585 series are directly con-
nected to the output of the device.
VIN
3.3V
C1
10µF
U1
RC1585
VIN
VOUT
+
ADJ
+
C2
100µF
R1
124
R2
24.9
VOUT
1.5V
+
C3
100µF
65-1586-16
Figure 14. Application Circuit (RC1585)
Table 1. Bill of Materials for Application Circuit for the RC1585
Item
Quantity
Manufacturer
Part Number
C1
1
Xicon
L10V10
C2, C3
2
Xicon
L10V100
R1
1
Generic
R2
1
Generic
U1
1
Fairchild
RC1585T
Description
10µF, 10V Aluminum
100µF, 10V Aluminum
124, 1%
24.9, 1%
5A Regulator
U1
RC1585-1.5
VIN
3.3V
VIN
VOUT
+
C1
GND
10µF
VOUT
1.5V
+
C3
100µF
65-1585-17
Figure 15. Application Circuit (RC1585-1.5)
Table 2. Bill of Materials for Application Circuit for the RC1585-1.5
Item
Quantity
Manufacturer
Part Number
Description
C1
1
Xicon
L10V10
10µF, 10V Aluminum
C3
1
Xicon
L10V100
100µF, 10V Aluminum
U1
1
Fairchild
RC1585T-1.5
5A Regulator
8
REV. 1.1.2

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