PGB102ST23NRHF Ver la hoja de datos (PDF) - Littelfuse, Inc
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PGB102ST23NRHF Datasheet PDF : 4 Pages
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PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Materials
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5FSNJOBUJPOT$PQQFS/JDLFM5JO
Solderability .*-45%.FUIPE
Soldering
Parameters
8BWFTPMEFS¡$TFDPOETNBYJNVN
3FnPXTPMEFS¡$TFDPOETNBYJNVN
Design Consideration
Because of the fast rise-time of the ESD transient, proper
QMBDFNFOUPG1VMTF(VBSETVQQSFTTPSTBSFBLFZEFTJHO
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
TVQQSFTTPST DPOOFDUFEGSPNTJHOBMEBUBMJOFUPHSPVOE
directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Environmental Specifications
Operating Temperature
Moisture Resistance
Thermal Shock
Vibration
Chemical Resistance
-65°C to +125°C
0402 series:
¡$3)IPVST
0603, ST23:
¡$3)IPVST
.*-45%.FUIPE
-65°C to 125°C, 30 min. cycle,
10 cycles
.*-45%.FUIPE
to 55 to 10 Hz, 1 min. cycle, 2
hrs each in X-Y-Z)
.*-45%.FUIPE
Solder Leach Resistance and
Terminal Adhesion
*1$&*"+45%
Soldering Parameters
Reflow Condition
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- Temperature Min (Ts(min))
Pre Heat -Temperature Max (T )
s(max)
-Time (min to max) (t )
s
Average ramp up rate (Liquidus Temp
(T ) to peak
L
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peakTemperature (T )
P
150°C
200°C
oTFDPOET
¡$TFDPOENBY
¡$TFDPOENBY
¡$
60 – 150 seconds
260°C
10 – 30 seconds
¡$TFDPOENBY
NJOVUFTNBY
#BTFEPO*1$+&%&$+45%
PGB1 Series
Specifications are subject to change without notice.
3
Revised: March 8, 2011
www.littelfuse.com
©2011 Littelfuse
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