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HYS72V32200GU-8B Ver la hoja de datos (PDF) - Infineon Technologies

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Fabricante
HYS72V32200GU-8B
Infineon
Infineon Technologies Infineon
HYS72V32200GU-8B Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
HYS 64(72)V16200/3222(0)0/64220GU
SDRAM Modules
Notes
1. An initial pause of 100 µs is required after power-up, then a Precharge All Banks command
must be given followed by 8 Auto Refresh (CBR) cycles before the Mode Register Set
Operation can begin.
2. AC timing tests have VIL = 0.4 V and VIH = 2.4 V with the timing referenced to the 1.4 V
crossover point. The transition time is measured between VIH and VIL. All AC measurements
assume tT = 1 ns with the AC output load circuit show. Specified tAC and tOH parameters are
measured with a 50 pF only, without any resisitve termination and with a input signal of 1 V/ns
edge rate between 0.8 V and 2.0 V.
CLOCK
t CH
2.4 V
0.4 V
t CL
tT
t SETUP
t HOLD
INPUT
1.4 V
OUTPUT
tAC
t LZ
tAC
t OH
1.4 V
t HZ
SPT03404
I/O
50 pF
Measurement conditions for
tAC and tOH
3. If clock rising time is longer than 1 ns, a time (tT/2 – 0.5) ns has to be added to this parameter.
4. Rated at 1.5 V
5. If tT is longer than 1 ns, a time (tT – 1) ns has to be added to this parameter.
6. Any time that the refresh Period has been exceeded, a minimum of two Auto (CBR) Refresh
commands must be given to “wake-up” the device.
7. Self Refresh Exit is a synchronous operation and begins on the 2nd positive clock edge after
CKE returns high. Self Refresh Exit is not complete until a time period equal to tRC is satisfied
once the Self Refresh Exit command is registered.
8. Referenced to the time which the output achieves the open circuit condition, not to output
voltage levels.
Semiconductor Group
11
1998-08-01

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