C9807_01 Ver la hoja de datos (PDF) - Peregrine Semiconductor Corp.
Número de pieza
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C9807_01 Datasheet PDF : 9 Pages
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PE42660
Preliminary Specification
Table 6. Mechanical Specifications
Parameter
Die Size (x,y)
Minimum
Die Size (x,y)
Wafer Thickness
180
Wafer Size
Typical
1.146 x 1.106
1.25 x 1.21
200
150
Maximum
220
Units
mm
mm
µm
mm
Test Conditions
As drawn
Including excess sapphire, max. tolerance
= ±0.1mm in either dimension
Table 7. Pad Coordinates
All pad locations originate from the die center and refer to the
center of the pad.
All pad openings are 60 x 60 µm except for Pad #3 which is 140 x 60 µm.
Minimum pad pitch is 80 µm.
Note 1. - Double pad, requires two bond wires.
Pad #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pad Name
ANT
TX1
GND1
TX2
GND
GND
VDD
V3
GND
V2
V1
GND
GND
RX4
GND
RX3
GND
RX2
GND
RX1
Pad Center (µm)
X
Y
1.9
488.1
-511.3
491.3
-511.3
168.9
-511.3
-153.5
-511.3
-233.5
-511.3
-491.3
-337.7
-491.3
25.7
-491.3
160.9
-491.3
296.1
-491.3
376.1
-491.3
511.3
-491.3
511.3
-223.7
511.3
-105.1
511.3
-25.1
511.3
93.5
511.3
173.5
511.3
292.1
511.3
372.1
511.3
490.7
Figure 9. Pad Numbering
1.25 mm
TX1 2
GND
GND 3
1.21 mm TX2 4
GND 5
1
PE42660
Die
20 RX1
19 GND
18 RX2
17 GND
16 RX3
15 GND
14 RX4
13 GND
6
7
8
9
10 11
12
Document No. 70-0192-02 │ www.psemi.com
©2005 Peregrine Semiconductor Corp. All rights reserved.
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