C9807_01 Ver la hoja de datos (PDF) - Peregrine Semiconductor Corp.
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C9807_01 Datasheet PDF : 9 Pages
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PE42660
Preliminary Specification
Electrical Test and Performance Specifications
PE42660 dice are 100% electrically tested for the
parameters listed below from Table 1 and Table 2. All
other parameters are guaranteed through design and
characterization.
• Insertion Loss (all ports)
• TX1 & TX2 Harmonics
• TX – RX Isolation
• IDD supply current
• Control pin leakages
Wafer and Die Packaging
Peregrine Semiconductor has two methods for shipping
dice to our customers. The shipping option used is
based on the customer’s requirements and the number
of dice.
Peregrine offers product dice in two packaging options:
Standard Die Carrier Packages (waffle pack) and dice
on Film Frames.
Wafer Mount/Dicing
In preparation for dicing, wafers are thinned and
polished and 100% electrically probed prior to
mounting on film frame tape and rings. Figure 6 shows
a wafer mounted on film frame using PVC backed
mounting tape. In preparation for shipment, wafers are
visually inspected after singulation and shipped with an
electronic map file providing good dice locations.
Storage and Preservation
Proper storage conditions are necessary to prevent
product contamination and/or degradation after
shipment.
Product should be stored in the original unopened
packaging or, once opened, in a nitrogen purged
cabinet at room temperature (45% + 15% relative
humidity controlled environment).
Singulated wafers mounted on film frames are intended
for immediate use and have a limited shelf life. This is
primarily due to the nature of the adhesive tape used
for mounting the product. This product can be stored
up to 30 days. This applies whether or not the material
has remained in its original sealed container. To reduce
the risk of contamination or degradation, it is
recommended that product not being used in the
assembly process be returned to their original
containers and resealed with a vacuum seal process.
Document No. 70-0192-02 │ www.psemi.com
Figure 6. Wafer on Film Frame
Figure 7. Dice and Wafer Processing Flow
Wafer
Processing
Visual
Inspection
100%
Electrical Test
Wafer
Singulation
Dice Picking
Process Control
Monitor (PCM)
Wafer Level
Reliability (WLR)
Ink Reject Die or
Electronic Wafer
M ap
100% Visual
Inspection
Carrier Loading
Backgrind
and Polish
Outgoing QA
Inspection
Pack and Ship
Wafers
Pack and Ship
Dice
Figure 8. Waffle Pack
Standard Die Carrier Package/Waffle Pack
Waffle packs are available to customers during product
development and prototyping phase only. Orders will
move to film frames at production launch or for large
quantity requirements.
Dice have been 100% electrically probed, singulated,
visually inspected and are packaged in a 2”x2” waffle
pack (400 dice per waffle pack).
©2005 Peregrine Semiconductor Corp. All rights reserved.
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