PCF8531 Ver la hoja de datos (PDF) - NXP Semiconductors.
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PCF8531 Datasheet PDF : 51 Pages
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NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
L
W
PCF8531
pitch
Y
X
Fig 4. Chip dimensions
001aag908
Table 4. Bonding pad dimensions
Pad
pad pitch (minimum)
bump dimensions
wafer thickness (excluding bumps)
die size L × W
[1] Die size including saw lane of 70 μm.
Size
Unit
70
μm
50 × 90 × 17.5 (±3)
μm
381
μm
12.14 × 1.86[1]
mm
6.2 Pin description
Table 5. Bonding pad description
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (μm) Y (μm) Description
-
1
5973.6 −821.7 dummy
-
2
5969.5 823.4
-
3
5899.5 823.4
-
4
5829.5 823.4
-
5
5479.5 823.4
-
6
5409.5 823.4
-
7
5059.5 823.4
-
8
4989.5 823.4
-
9
4639.5 823.4
-
10
4569.5 823.4
-
11
4219.5 823.4
-
12
4149.5 823.4
-
13
3799.5 823.4
-
14
3729.5 823.4
OSC
15
3449.5 823.4
oscillator input
[1]
VLCDSENSE
16
3169.5 823.4
voltage multiplier regulation input (VLCD) [2]
PCF8531
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 May 2011
© NXP B.V. 2011. All rights reserved.
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