NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
PCF8531
Product data sheet
Table 5. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (μm) Y (μm) Description
C67
171
303.6
−821.7 LCD column driver output
C68
172
373.3
−821.7
C69
173
443.6
−821.7
C70
174
513.6
−821.7
C71
175
583.6
−821.7
C72
176
653.6
−821.7
C73
177
723.6
−821.7
C74
178
793.6
−821.7
C75
179
863.6
−821.7
C76
180
933.6
−821.7
C77
181
1003.6 −821.7
C78
182
1073.6 −821.7
C79
183
1143.6 −821.7
C80
184
1213.6 −821.7
C81
185
1283.6 −821.7
C82
186
1353.6 −821.7
C83
187
1423.6 −821.7
C84
188
1493.6 −821.7
C85
189
1563.6 −821.7
C86
190
1633.6 −821.7
C87
191
1703.6 −821.7
C88
192
1773.6 −821.7
C89
193
1843.6 −821.7
C90
194
1913.6 −821.7
C91
195
1983.6 −821.7
C92
196
2053.6 −821.7
C93
197
2123.6 −821.7
C94
198
2193.6 −821.7
C95
199
2263.6 −821.7
C96
200
2403.6 −821.7
C97
201
2473.6 −821.7
C98
202
2543.6 −821.7
C99
203
2613.6 −821.7
C100
204
2683.6 −821.7
C101
205
2753.6 −821.7
C102
206
2823.6 −821.7
C103
207
2893.6 −821.7
C104
208
2963.6 −821.7
C105
209
3033.6 −821.7
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 May 2011
© NXP B.V. 2011. All rights reserved.
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