PCF85103C-2(2002) Ver la hoja de datos (PDF) - Philips Electronics

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Fabricante

PCF85103C-2
(Rev.:2002)

256 × 8-bit CMOS EEPROM with I2C-bus interface

Philips Electronics 

Philips Semiconductors

PCF85103C-2

256 × 8-bit CMOS EEPROM with I2C-bus interface

• For packages with leads on four sides, the footprint must be placed at a 45° angle

to the transport direction of the printed-circuit board. The footprint must

incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the

need for removal of corrosive residues in most applications.

14.2.3 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time

must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

14.3 Through-hole mount packages

14.3.1 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total

contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

plastic body must not exceed the specified maximum storage temperature (Tstg(max)).

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

14.3.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400 °C, contact may be up to 5 seconds.

9397 750 09646

Product data

Rev. 02 — 09 May 2002

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

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