Die Characteristics
DIE DIMENSIONS:
63 mils x 44 mils x 19 mils
1600µm x 1130µm x 483µm
METALLIZATION:
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
V-
HFA1110
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
52
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
HFA1110
NC
IN
NC
NC
NC
NC
V+
OUT
8
FN2944.8
June 6, 2006