SPT7824BCS Ver la hoja de datos (PDF) - Signal Processing Technologies

Número de pieza

componentes Descripción

Fabricante

SPT7824BCS

10-BIT, 40 MSPS, TTL OUTPUT A/D CONVERTER

Signal Processing Technologies 

PIN ASSIGNMENTS

DGND 1

D0

2

D1

3

D2

4

D3

5

D4

6

D5

7

D6

8

D7

9

D8

10

D9

11

D10 12

DGND 13

DVCC 14

DIP/PDIP/SOIC

28 DVCC

27 V EE

26 AGND

25 V CC

24 VFB

23

V

SB

22 V

RM

21

V

IN

20 V

ST

19 V FT

18

V

CC

17 AGND

16

V

EE

15 CLK

PIN FUNCTIONS

Name

DGND

D0-D9

D10

CLK

VEE

AGND

VCC

VIN

DVCC

VRM

VFT

VST

VFB

VSB

Function

Digital Ground

TTL Outputs (D0=LSB)

TTL Output Overrange

Clock

-5.2 V Supply (Analog)

Analog Ground

+5.0 V Supply (Analog)

Analog Input

Digital +5.0 V Supply

Middle of Voltage Reference Ladder

Force for Top of Reference Ladder

Sense for Top of Reference Ladder

Force for Bottom of Reference Ladder

Sense for Bottom of Reference Ladder

ORDERING INFORMATION

PART NUMBER

TEMPERATURE RANGE

PACKAGE TYPE

SPT7824AIJ

SPT7824BIJ

SPT7824ACN

SPT7824BCN

SPT7824ACS

SPT7824BCS

SPT7824AMJ

SPT7824BMJ

-25 to +85 °C

-25 to +85 °C

0 to +70 °C

0 to +70 °C

0 to +70 °C

0 to +70 °C

-55 to +125 °C

-55 to +125 °C

28L Sidebrazed DIP

28L Sidebrazed DIP

28L Plastic DIP

28L Plastic DIP

28L SOIC

28L SOIC

28L Sidebrazed DIP

28L Sidebrazed DIP

Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly

granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.

WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific

written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably

expected to result in significant personal injury or death.

Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device

failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.

SPT

11

SPT7824

3/11/97

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