NLU1G14(2008) Ver la hoja de datos (PDF) - ON Semiconductor
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NLU1G14 Datasheet PDF : 8 Pages
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NLU1G14
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE C
D
ÉÉÉ PIN ONE
REFERENCE
ÉÉÉ 2X
ÉÉÉ 0.10 C
TOP VIEW
2X
0.10 C
0.10 C
10X
0.08 C
SIDE VIEW
A
B
E
(A3)
A
A1
EDGE OF PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
L1
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
DETAIL A
PAD AS WELL AS THE TERMINALS.
Bottom View
MILLIMETERS
(Optional)
DIM MIN MAX
A 0.45 0.55
ÉÉÉÉÉÉ EXPOSED Cu
MOLD CMPD
A3
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
A1
DETAIL B
L1 0.00 0.15
L2 0.40 0.50
Side View
SEATING
PLANE
C
(Optional)
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
5X L
1
3
L2
6X b
0.10 C A B
6
0.05 C NOTE 3
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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