NE5230, SA5230, SE5230
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Single Supply Voltage
Dual Supply Voltage
Input Voltage (Note 1)
Differential Input Voltage (Note 1)
Common−Mode Voltage (Positive)
Common−Mode Voltage (Negative)
Power Dissipation (Note 2)
Thermal Resistance, Junction−to−Ambient
N Package
D Package
Operating Junction Temperature (Note 2)
Operating Temperature Range
NE
SA
SE
80 Output Short−Circuit Duration to Either Power Supply Pin (Notes 2 and 3)
VCC
VS
VIN
VCM
VCM
PD
RqJA
TJ
TA
18
±9
±9 (18)
±VS
VCC + 0.5
VEE − 0.5
500
130
182
150
0 to 70
−40 to 85
−40 to 125
Indefinite
V
V
V
V
V
V
mW
°C/W
°C
°C
s
Storage Temperature
Tstg
−65 to 150
°C
Lead Soldering Temperature (10 sec max)
Tsld
230
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Can exceed the supply voltages when VS ≤ ±7.5 V (15 V).
2. The maximum operating junction temperature is 150°C. At elevated temperatures, devices must be derated according to the package thermal
resistance and device mounting conditions.
Derate above 25°C at the following rates:
N package at 7.7 mW/°C
D package at 5.5 mW/°C.
3. Momentary shorts to either supply are permitted in accordance to transient thermal impedance limitations determined by the package and
device mounting conditions.
RECOMMENDED OPERATING CONDITIONS
Characteristic
Single Supply Voltage
Dual Supply Voltage
Common−Mode Voltage (Positive)
Common−Mode Voltage (Negative)
Temperature
Value
Unit
1.8 to 15
V
±0.9 to ±7.5
V
VCC + 0.25
V
VEE − 0.25
V
NE Grade
0 to +70
°C
SA Grade
−40 to +85
SE Grade
−40 to +125
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